Semiconductor

Solin has over 20 years of experience in Manufacturing, Research & Development of Ultra Thin & High Precision Diamond Dicing Blades for many Industries/Applications. We are a  "Partner in Your Success". And can help you:

·         ELIMINATE / MINIMIZE CHIPPING

·         IMPROVE SURFACE FINISH QUALITY

·         INCREASE DICING BLADE LIFE

·         PRESERVE TRUE MATERIAL MICROSTRUCTURE

  • REDUCE & ELIMINATE MATERIAL DEFORMATION
·         INCREASE PRODUCTION RATE

·         IMPROVE PART GEOMETRY, STRAIGHTNESS & TOLERANCES 

·         IMPROVE DICING PROCESS CONSISTENCY 

·         IMPROVE PRODUCTIVITY 

·         REDUCE TOTAL COST PER CUT & MUCH MORE